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Microelectronics International (MI) comprises a multi-disciplinary study of the various technologies, processes and current practices associated with miniaturized electronic devices and advanced packages.

ISSN: 1356-5362
eISSN: 1356-5362

Aims and scope

Microelectronics International (MI) provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering. It represents a current, comprehensive and practical information tool. The Editor, Dr John Atkinson, welcomes contributions to the journal including technical papers, research papers, case studies and review papers for publication. Please view the Author Guidelines for further details.

Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages. Among the broad range of topics covered are:

  • Advanced packaging
  • Ceramics
  • Chip attachment
  • Chip on board (COB)
  • Chip scale packaging
  • Flexible substrates
  • MEMS
  • Micro-circuit technology
  • Microelectronic materials
  • Multichip modules (MCMs)
  • Organic/polymer electronics
  • Printed electronics
  • Semiconductor technology
  • Solid state sensors
  • Thermal management
  • Thick/thin film technology
  • Wafer scale processing

This journal is aligned with our responsible management goal

We aim to champion researchers, practitioners, policymakers and organisations who share our goals of contributing to a more ethical, responsible and sustainable way of working.

SDG 8 Decent work & economic growth
SDG 9 Industry, innovation & infrastructure
SDG 10 Reduced inequalities
SDG 11 Sustainable cities & communities
SDG 12 Responsible consumption & production
SDG 13 Climate action
Find out about our responsible management goal