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Microelectronics International (MI) invites interested researchers to submit their work to the journal!
Introduction
Microelectronics International has always attracted a very strong readership and contributor base from the highly specialised subject area of microelectronics packaging. It is one of the very few journals directly addressing this increasingly important and multidisciplinary subject area. The journal also attracts high quality contributions from the wider area of microelectronics resulting in a high diversity of technology that provides the modern microelectronics technologist with a source of new knowledge spanning the disciplines that all contribute to the modern microelectronics industry. These include areas such as printed electronics, nanotechnology, micromachining, organic/polymer electronics and solid-state sensors, in addition to the latest advances in microelectronics packaging technologies. The constantly evolving nature of this subject area also attracts contributions relating to the emergence of novel materials, together with their processing and handling, in increasingly important areas such as flexible electronics technologies.
Being at the forefront of technology, Microelectronics International is indexed by SCIE and Scopus, and attracts a relatively high number of citations resulting in its citation impact factors and usage impact factors continuing to rise. The journal has always had a very high applications content with a significant proportion of contributions from industry. As such, its applicability to business leaders, practitioners and consultants in both public and private sector organizations is highly relevant. The journal provides a very wide-ranging platform for current and future technologies and provides an extremely useful source of references in this important but increasingly diverse subject area. The availability of applications that draw so heavily across the widest spectrum of the sciences also lends its use as a source of examples for the pure sciences and mathematics. Among the many aspects driving innovation in the microelectronics sector, environmental concerns have had one of the biggest impacts. The needs of society in terms of its increasing demand for consumer electronics products has had to be balanced by its protection from pollutants and the protection of natural resources. Many of the novel techniques for microelectronics packaging featuring in the journal have been developed to specifically address these concerns, such as the removal of substances hazardous to health and the reduction of energy consumption in the production and use of consumer goods.
List of topic areas
• Advanced packaging
• Ceramics
• Chip attachment
• Chip on board (COB)
• Chip scale packaging
• Flexible substrates
• MEMS
• Micro-circuit technology
• Microelectronic materials
• Multichip modules (MCMs)
• Organic/polymer electronics
• Printed electronics
• Semiconductor technology
• Solid state sensors
• Thermal management
• Thick/thin film technology
• Wafer scale processing
Submissions Information
Submissions are made using ScholarOne peer-review online platform. Registration and access are available by clicking the button below:
Author guidelines must be strictly followed.
Submitted articles must not have been previously published, nor should they be under consideration for publication anywhere else, while under review for this journal.
Editor-in-Chief
Professor John Karl Atkinson
University of Southampton – UK
[email protected]
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