Calls for papers
Here are the latest calls for papers and special issues from our extensive journal and case study range.
Important note for authors: phishing scams
Closes:
Agentic AI and Entrepreneurship: Bright and Dark Sides Across the Venture Cycle
Journal of Entrepreneurship in Emerging Economies
This special issue examines how agentic AI reshapes entrepreneurship, highlighting bright and dark sides across venture creation, scaling, ecosystems, and responsible innovation.
Guest editor(s)
Prof. Dr. Victor Tiberius,
Dr. Alhamzah Al Sayed Noor,
Prof. Dr. Mumtaz Ali Memon,
Closes:
Current trends in European real estate markets: Proceedings of the ESPI-IREC 2024 Conference
Journal of European Real Estate Research
The aim of this special issue is to highlight the best contributions to the ESPI-IREC 2024 real estate conference.
Guest editor(s)
Samuel Depraz,
Closes:
The Role of Institutions in Entrepreneurship Education: Taking Stock and Moving Forward
Education + Training
This Special Issue explores the strategic integration of generative AI in higher education, focusing on measurable learning outcomes, employability, curriculum innovation, and workforce readiness.
Guest editor(s)
Gustav Hägg,
Agnieszka Kurczewska,
Tatiana Lopez,
David Pulido Urbano,
Closes:
Agentic Artificial Intelligence and the Future of Multinational Enterprises: Opportunities, Risks, and Reconfigurations
Review of International Business and Strategy
This Special Issue seeks to deepen insight into how MNEs worldwide leverage agentic AI in their international strategies while managing the organizational, strategic, and ethical challenges associated...
Guest editor(s)
Pervez Ghauri,
Jaeyoung Cho,
Sadaf Khurshid,
Melodena Stephens,
Closes:
Fresh narratives on Management Development
Journal of Management Development
This special issue features 3,000-word reports from multidisciplinary researchers on contemporary challenges in management development.
Guest editor(s)
Szabolcs Rámháp,
Luciana Faluba Damázio,
Phoebe Chuah,
Yuan Zhai,
Closes:
Materials Science and Advanced Applications of Wire Bonding in Microelectronics Packaging: From Fine-Pitch Interconnects to Next-Generation Reliability
Microelectronics International
This Special Issue advances wire-bonding materials, reliability, hybrid integration, and AI-enabled process control, linking academic research with industrial microelectronics packaging practice.
Guest editor(s)
Dr C L Gan,
Dr Christopher Breach,
Dr Chen-Yu (Luka) Huang,
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