Thank you to the 2023 Reviewers of Soldering & Surface Mount Technology

The publishing and editorial teams would like to thank the following, for their invaluable service as 2023 reviewers for this journal. We are very grateful for the contributions made. With their help, the journal has been able to publish such high-quality articles: 

Aamir, Dr Muhammad
Abas, Mohamad Aizat
Abdullah, Muhammad Asyraf 
Abdulridha, Wasna’a M.
Abu Bakar, Maria
Cai, Chongyang
Chen, Chih-Ming
Chen, Dongxu
Chen, H.-T.
Cheung, Noé
Chung, Soonwan
Ciszewski, Piotr
Dalouji, Vali
Durairaj, Rajkumar
Felba, Jan 
Fu, Guicui
Gan, Guisheng
Géczy, Attila
Guo, Jingdong
Hodulova, Erika
Huang, Chien-Yi
Huh, Seok Hwan
Idris, Siti Rabiatull Aisha
Kakitani, Rafael
Kanlayasiri, Kannachai
Kim, Choong-Un
Kunwar, Anil
Lai, Yangyang
Lee, Pei-Tzu
Lee, Yongwon
Li, Wangyun
Li, Yulong
Li, Zhenfeng
Liang, Kaiming
Liu, Jie
Liu, Yang
Lu, Xiuzhen
Mayappan, Ramani
Mysliwiec, Marcin
Ng, Fei Chong
Öztürk, Esra
Pinto Da Silva, Cassio Augusto
Rodrigues, Adilson
Sandera, Josef
Sharif, A.
Singh, Sudhanshu
Tatsumi, Hiroaki
Veselý, Petr
Wan Yusoff, Wan 
Wang, Xiaojing
Wong, King Jye
Xia, Weisheng
Xiong, Ming-Yue
Yang, Gangli
Yang, Ying
Ye, Huan
Yen, Yee-Wen
Yeo, Siang Miang
Yeoh, Keat Hoe
Yin, Limeng
Yow, Ho Kwang 
Zhang, Hao
Zhang, Liang
Zhang, Peng
Zhou, Hongzhi