Soldering & Surface Mount Technology

ISSN: 0954-0911


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2017 Impact Factor: 1.137*
5-year Impact Factor (2017): 1.057*

CiteScore 2017: 1.43
CiteScoreTracker 2018: 1.04 (Updated Monthly)

Aims & Scope

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.

Key benefits

Soldering & Surface Mount Technology is a unique, authoritative, international and multi-disciplinary periodical for those with a research and application interest in all branches of soldering and surface mount technologies. The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. All submissions are subject to double-blind peer review.

Key journal audiences

Soldering & Surface Mount Technology represents a comprehensive and independent information source for research, application and current awareness purposes for researchers, senior technical staff and practising engineers within the electronics assembly industry, contract manufacturers, original equipment manufacturers (OEMs) and users together with all academic branches of engineering and science together with their information providers, namely academic, institutional, technical and corporate libraries.

Scope/Coverage:

The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices.  The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.  Among the range of topics covered are:

• Soldering science and technology
• Novel soldering processes and new solder alloys
• Surface mount technology (SMT)
• Surface mount assembly
• Advanced packaging technologies and 3D interconnects
• Flip chip/BGA/SiP/TSV
• Novel substrates and embedded components
• Solderable finishes and coatings
• Screen printing
• Conductive adhesives and conformal coatings
• Reliability
• Quality control
• Inspection and testing
• Rework and repair
• Environmental aspects

Soldering & Surface Mount Technology is indexed and abstracted in:

• Business Source Complete
• Cabell's Directory of Publishing Opportunities in Physics
• CSA Engineering Research Database
• CSA High Technology Research Database with Aerospace
• CSA Materials Research Database with METADEX
• CSA Technology Research Database 
• EBSCO
• EI Compendex
• INSPEC
• Journal Citation Reports/Science Edition
• Norwegian Register for Scientific Journals
• Proquest Science Journals
• ReadCube Discover
• Recent Advances in Manufacturing Database (RAM)
• Referativnyi Zhurnal
• Scopus
• TOC Premier
• Zetoc

And ranked in:

• Science Citation Index Expanded SCIE (Clarivate Analytics)
• Scopus

Soldering & Surface Mount Technology is available as part of an online subscription to the Emerald Engineering eJournals Collection. For more information, please email collections@emeraldinsight.com or visit the Emerald Engineering eJournals Collection page.

This journal is a member of and subscribes to the principles of the Committee on Publication Ethics. More on Emerald's approach is available in our Publication Ethics guidelines.
 

* 2017 Journal Citation Reports® (Clarivate Analytics, 2018)