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Awards for Excellence - 2019

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner(s)

Volume 30 issue 1
SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly
Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman

Highly commended

Volume 30 issue 1
Rheological characterization of non-Brownian suspensions based on structure kinetics
Kurian J. Vachaparambil, Gustaf Mårtensson, Lars Essén

Outstanding reviewers

Assoc. Pro Oliver Krammer
Dr Emee Marina Salleh