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Awards for Excellence - 2016

Outstanding Papers

Award journal index

Soldering & Surface Mount Technology


Volume 27 issue 1
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint
Peter K. Bernasko, Sabuj Mallik, G. Takyi

Highly commended

Volume 27 issue 1
A new approach to investigate conductive anodic filament (CAF) formation
Ling Chunxian Zou, Chris Hunt

Outstanding reviewers

Agata Skwarek
David Hutt