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 > Electrical and Electronic Engineering Articles

Electrical and Electronic Engineering Articles


Our index of selected Electrical and Electronic Engineering articles

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Energy conservation and related best practices in printed circuit board

From: Circuit World, volume: 36 issue: 1 pp38-42, 2010
There are many opportunities to reduce energy consumption across the whole printed circuit board (PCB) manufacturing process. Additional savings may also be made by enhancements to the broader activities within PCB manufacturing plants. In this article, Martin Goosey and Rod Kellner present details of key best practices that can help PCB manufacturing companies to optimize energy consumption, conserve materials, and reduce waste and costs.

Principles for responsible metals supply to electronics

From: Social Responsibility Journal, volume: 6 issue: 1 pp126-142, 2010
MakeITfair (a non-governmental campaign which is working towards raising awareness of social and environmental problems in the production chain of the consumer electronics industry) recently published market research carried out in four European countries which found over half of the young people interviewed were willing to pay more for responsibly produced consumer electronics. In the first year of a three-year programme, MakeITfair published three research reports addressing the links between electronic companies' demand for metals and the social and environmental problems of mining tin, cobalt and platinum. In 2008 MakeITfair went on to publish a list of principles on the extractive phase of the electronics supply chain proposing responsible purchasing policies and actions. This paper aims to generate useful information to companies, civil society and industry organizations concerned about the role of electronics in driving social and environmental problems in mining operations by critically analysing each of MakeITfair's principles.

A quantum-inspired evolutionary hybrid intelligent approach for stock market prediction

From: International Journal of Intelligent Computing and Cybernetics, volume: 3 issue: 1 pp24-54, 2010
Prediction systems are widely used for decision making, the success of the prediction being a key element for the success or failure of a given decision, particularly in financial and economic applications (financial marketing, stock exchange, etc.). However, current prediction models, such as ARIMA models, artificial neural networks and hybrid intelligent approaches, all have their limitations thus affecting the accuracy of the prediction generated. In this paper, the authors present a new quantum-inspired, evolutionary hybrid intelligent approach for stock market prediction that provides a better prediction model for times series representation, and performs a behavioural statistical test to adjust the time-phase distortions that frequently appear in financial time series.

Energy conservation and related best practices in printed circuit board (PCB) manufacturing

From: Circuit World, volume: 36 issue: 1 pp38-42, 2010
Energy used in industrial production typically accounts for over one-third of all energy consumed and it is one of the most important factors influencing the overall costs of production across a wide section of industry. Additionally, the high costs of natural gas and oil are having a major impact on European manufacturers that is directly reducing their competitiveness in global markets. It is therefore vitally important to ensure that every viable technique for minimizing energy demand within a manufacturing facility is utilized in order to reduce costs and enhance competitiveness. This paper presents the details of key best practices that can help printed circuit board manufacturing companies to optimize energy consumption, conserve materials, and reduce waste and costs.

A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit

From: Microelectronics International, volume: 26 issue: 3 pp9-21, 2009
The purpose of this paper is to develop a highly miniaturized wireless inertial sensor system based on a novel 3D packaging technique using a flexible printed circuit. The device is very suitable for wearable applications in which small size and lightweight are required such as body area network, medical, sports and entertainment applications.

Effects of conformal coating on anisotropically conductive adhesive joints; a medical perspective

From: Soldering & Surface Mount Technology, volume: 21 issue: 4 pp4-11, 2009
In the future, implantable medical devices will have more and more electronics in them. Different measurements related to physiological functions and the operation of devices are made in real time, and portable and implantable measurement systems are becoming more common. Already, today implantable devices help patients considerably, for example in heart illnesses and hearing impairments. There are even more disorders that could be alleviated with implantable devices and electronics will have an important role in them. Since electronic products usually fail first at interconnections, it is crucial to study their reliability. This paper studies the effects of conformal coating on the reliability of adhesive joints.

Modelling and simulation of aircraft anti-skid braking and steering using co-simulation method

From: COMPEL, volume: 28 issue: 6 pp1471-1488, 2009
This paper presents an advanced method to study the ground manoeuvres of aircraft anti-skid braking and steering, and establishes an integrated aircraft model of airframe, landing gear, steering system, and anti-skid braking system to investigate the interaction of each subsystem via simulation.

Six sigma analysis of SMD feeding parameters and board assembly quality

From: Soldering & Surface Mount Technology, volume: 21 issue: 3 pp39-46, 2009
Little interest has been shown in pickup conditions and parameters and their effect on placement accuracy in the literature before. The purpose of this paper is to find out the possible link between pickup conditions and placement accuracy of typical discrete chip components.

Reliability analysis of a novel fan-out type WLP

From: Soldering & Surface Mount Technology, volume: 21 issue: 3 pp30-38, 2009
The wafer level package (WLP) is a cost-effective solution for electronic packaging and has been increasingly applied in recent years. The purpose of this paper is to propose a newly developed packaging technology, based on the concepts of the WLP, the panel base package technology, in order to further obtain the capability of signal fan-out for fine-pitched integrated circuits.

Sorting Pareto solutions: a principle of optimal design for electrical machines

From: COMPEL, volume: 28 issue: 5 pp1227-1235, 2009
Design and production of small electrical machines are characterized by a trend towards miniaturization, especially in the automotive field, where the number of electromechanical devices featuring drive-by-wire systems are ever increasing. As a result of reduced size and weight, the devices are characterized by increasing power densities. For this reason, reduction of power loss has become a strategic target for the design of energy-saving, small electrical machines. From the electromagnetic point of view, the classical problem of losses in the active materials, i.e. copper and iron, arises once again and begs for new solutions. In this paper, a procedure to provide the optimal solutions located along the Pareto front is proposed.