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Awards for Excellence - 2018

Outstanding Papers

Award journal index

Soldering & Surface Mount Technology


Volume 29 issue 3
Study of direct soldering of silicon and copper substrate by use of Bi-based solders with lanthanides addition
Roman Kolenak

Highly commended

Volume 29 issue 4
CUF scaling effect on contact angle and threshold pressure
Fei Chong Ng, Mohamad Aizat Abas, MZ Abdullah, MHH Ishak, Gean Yuen Chong

Volume 29 issue 1
Optimization of solder paste quantity considering the properties of solder joints
Martin Hirman, Frantisek Steiner

Volume 29 issue 2
Investigation and prediction of solder joint failure analysis for ball grid array package subject to mechanical bending environment
Mei-Ling Wu, Jia-Shen Lan

Outstanding reviewer

Nick Yue