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Awards for Excellence - 2017

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 28 number 2
Time-based reflow soldering optimization by using adaptive Kriging-HDMR method
Liming Chen, Enying Li, Hu Wang

Highly commended

Volume 28 number 4
Preparation of PEG-rosin derivative for water soluble rosin flux
Kanlaya Phaphon, Sumrit Wacharasindhu, Amorn Petsom

Volume 28 number 1
Mechanical reliability of solder joints in PCBs assembled in surface mount technology
Janusz Borecki, Tomasz Serzysko

Volume 28 number 2
Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review
Chun Sean Lau, C.Y. Khor, D. Soares, J.C. Teixeira, M.Z. Abdullah

Outstanding reviewer

Agata Swarek