Awards for Excellence - 2016

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 27 number 1
Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint
Peter K. Bernasko, Sabuj Mallik, G. Takyi

Highly commended

Volume 27 number 1
A new approach to investigate conductive anodic filament (CAF) formation
Ling Chunxian Zou, Chris Hunt

Outstanding reviewers

Agata Skwarek
David Hutt