Awards for Excellence - 2015

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 26 number 1
Reliability investigations for high temperature interconnects
Rainer Dudek, Andreas Fix, Joerg Trodler, Peter Sommer, Bernd Michel, Sven Rzepka

Highly commended

Volume 26 number 1
Characterization of nano-enhanced interconnect materials for fine pitch assembly
Janusz Sitek, Lilei Ye, Marek Koscielski, Johan Liu, Yan Zhang, Shiwei Ma, Jing-yu Fan