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Awards for Excellence - 2015

Outstanding Papers

Award journal index

Soldering & Surface Mount Technology


Volume 26 issue 1
Reliability investigations for high temperature interconnects
Rainer Dudek, Andreas Fix, Joerg Trodler, Peter Sommer, Bernd Michel, Sven Rzepka

Highly commended

Volume 26 issue 1
Characterization of nano-enhanced interconnect materials for fine pitch assembly
Janusz Sitek, Lilei Ye, Marek Koscielski, Johan Liu, Yan Zhang, Shiwei Ma, Jing-yu Fan