Awards for Excellence - 2015

Outstanding Papers


Award journal index



Circuit World

Winner

Volume 40 number 3
Factors governing filling of blind via and through hole in electroplating
Miao Wu, Chengqiang Cui, Jing Wang

Highly commended

Volume 40 number 3
UV laser cutting of glass-epoxy material for opening flexible areas of rigid-flex PCB
Shouxu Wang, Zhihua Tao, Wei He, Shijing Chen, Yuanming Chen, Huan Xu, Li Feng

Volume 40 number 2
Effects of MnSO4 on microstructure and electrical resistance properties of electroless Ni?P thin-films and its application in embedded resistor inside PCB
Liyi Li, Wei He, Chia-Yun Chen, Zhihua Tao, Guoyun Zhou, C.P. Wong

Volume 40 number 4
Electroformed conductor patterns in electronics manufacturing
Satu Pasanen, Pekka Ruuskanen, Teija Laine-Ma, Mikko Karttunen