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Awards for Excellence - 2014

Outstanding Papers

Award journal index

Soldering & Surface Mount Technology


Volume 25 number 2
Electrodeposition of lead-free solder alloys
Yingxin Goh, A.S.M.A. Haseeb, Mohd Faizul Mohd Sabri

Highly commended

Volume 25 number 4
Cu filling of TSV using various current forms for three-dimensional packaging application
Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jea Pil Jung

Volume 25 number 4
A review: influence of nano particles reinforced on solder alloy
Ervina Efzan Mhd Noor, Amares Singh, Yap Tze Chuan

Volume 25 number 3
Comparison study of SAC405 and SAC405+0.1%Al lead free solders
Roman Kolen