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Awards for Excellence - 2013

Outstanding Papers

Award journal index

Soldering & Surface Mount Technology


Volume 3 issue 24
Three-dimensional thermal investigations at board level in a reflow oven using thermal-coupling method
Chun-Sean Lau, M.Z. Abdullah, F. Che Ani

Highly commended

Volume 2 issue 24
Thermo-mechanical behaviour of DBC substrate assemblies subject to soldering fabrication processes
Duncan Camilleri

Volume 4 issue 24
Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder
Peng Xue, Songbai Xue, Yifu Shen, Zhengxiang Xiao, Hong Zhu, Weimin Long, Xinquan Yu