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Awards for Excellence - 2011

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 22 number 1
X-ray solder alloy volume measurement (XSVM) in pin-in-paste technology (PIP)
Mihály Janóczki and László Jakab

Highly commended

Volume 22 number 2
Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfaces
R.L. Xu, Y.C. Liu, C. Wei and L.M. Yu

Volume 22 number 2
Thermomechanically loaded lead-free LGA joints in LTCC/PWB assemblies
Olli Nousiainen, Timo Urhonen, Tero Kangasvieri, Risto Rautioaho and Jouko Vähäkangas

Volume 22 number 3
Investigation of Sn-Zn-Bi solders – Part I: surface tension, interfacial tension and density measurements of SnZn7Bi solders
K. Bukat, Z. Moser, J. Sitek, W. Gasior, M. Koscielski and J. Pstrus

Volume 22 number 4
Investigation of Sn-Zn-Bi solders – Part II: wetting measurements on Sn-Zn7Bi solders on copper and on PCBs with lead-free finishes by means of the wetting balance method
K. Bukat, Z. Moser, J. Sitek, W. Gasior, M. Koscielski and J. Pstrus