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Awards for Excellence - 2010

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 21 number 3
Six sigma analysis of SMD feeding parameters and board assembly quality
Pekka Kytösaho and Timo Liukkonen

Highly commended

Volume 21 number 2
A study of thermo-mechanical reliability of lead-free PTH solder joints
Jennifer Nguyen, David Geiger, Dan Rooney and Dongkai Shangguan

Volume 21 number 4
Local melt process of solder bumping by induction heating reflow
Hongbo Xu, Mingyu Li Yonggao Fu, Ling Wang and Jongmyung Kim

Volume 21 number 4
On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parameters
D. Di Maio and C.P. Hunt