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Awards for Excellence - 2008

Outstanding Papers


Award journal index



Soldering & Surface Mount Technology

Winner

Volume 19 number 1
Effects of thermal history on the intermetallic growth and mechanical strength of Pb-free and Sn-Pb BGA solder balls
J. Liang, N. Dariavach, P. Callahan, D. Shangguan

Highly commended

Volume 19 number 2
High-cycle fatigue testing of Pb-free solder joints
N. Barry, I.P. Jones, T. Hirst, I.M. Fox, J. Robins